https://wccftech.com/intel-silicon-bridges-super-die-patents-mcm-approach/

Intel appears to be readying to take a step towards the Multi-Chip-Module (MCM) approach, following in the steps of AMD with its Ryzen Threadripper and EPYC Rome and Naples HEDT and server processors with their chiplet designs, with the initial patent detailing silicon bridge technology.

As the size of silicon dies continue to become larger and push the boundaries of process technology and manufacturing, alternative methods of increasing performance must be taken into account. For AMD, Multi-Chip-Module technology had been the method of choice to continue to push increased performance without the need for a process shrink.